Coolleo B50 ARGB 

High-Conductivity Anti-Gravity Optimized Heat Pipes

Optimized wick structure and precisely calibrated working fluid charge enable efficient liquid-vapor phase transition,

delivering superior thermal performance in both horizontal and vertical orientations.

TDP: 235W

Direct-Touch Heat Pipe Technology

Precision Core Contact for Maximum Efficiency.

5 Clustered Direct-Touch Heat Pipes Featuring an optimized contact surface tailored for next-gen CPUs,

this design efficiently channels heat to the dense fin array for rapid thermal dissipation.

All-New Chromatic Top Cover

Sleek ARGB Lighting on Top Cover with Dynamic Multi-Color Effects,

Enhancing System Aesthetics to a Dazzling Level.

Slim Tower Design with un blocked memory

Slim-profile tower architecture with optimized hardware clearance.

148mm height ensures full compatibility across mainstream components and chassis configurations.

Multi-Platform Compatibility

Universal Intel/AMD Mounting Bracket | Optimized Installation Experience

Supports Intel Platforms: Intel LGA 1200/1151/1150/1155/1700/1851

Supports AMD Platforms: AM4/AM5